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Where the path to tomorrow's IC technology lies

The power-performance-area (and cost) advances of the last five decades have mostly been achieved through dimensional scaling of the transistor. What will the semiconductor industry do after transistor scaling crosses the nanometer threshold, from 16/12 nm, 10 nm, 7 nm, 5 nm, 3 nm, 2 nm, 1.4 nm to sizes below a nanometer? Will these advanced logic technologies continue to provide the energy efficiency required of future computing systems? Will new applications and computation workloads demand new device technologies and their integration into future systems? These are some of the most pressing questions facing the semiconductor industry today.

The path for IC technology development going forward is no longer a straight line. The need for out-of-the-box solutions is ushering in a golden age of innovation. Future electronic systems will require co-innovation of the computing architecture together with device and packaging technology. In these pages, you will find some of the ideas that are in TSMC's research pipeline today.

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