|Stanford SystemX Alliance|
SystemX emphasizes application-driven, system-oriented research. Its areas of interest include hardware and software at all levels of the system stack from materials and devices to systems and applications in electronics, networks, energy, mobility, bio-interfaces, sensors, and other real-world domains.
|Non-volatile Memory Technology Research Initiative (NMTRI)|
Vision for Non-volatile Memory Technology Research Initiative aims at dealing with challenges of increasing needs for embedded memory with high density and low cost with power minimization by forming an interdisciplinary team of faculty, staff and students to look into technical feasibility at the device level, circuit/system level as well as develop a fundamental understanding for a variety of new non-volatile memory phenomena, materials and processes.
|Berkeley Emerging Technologies Research (BETR) Center|
New concepts for more energy-efficient logic switches (transistor replacements) and more energy-efficient on-chip communication (interconnect replacements) are needed to extend and go beyond the era of Moore’s Law. In addition to breakthroughs in solid-state science and technology, innovations in circuit design and system architecture will be necessary to avert a power crisis for computing. Focus areas of the center include the Looming Power Crisis for Computing, Advent of the Internet of Things, and Proliferation of Big Data Applications.
|Berkeley Device Modeling Center|
The center is focused on developing compact modeling solutions for advanced semiconductor devices. The BSIM (Berkeley Short-channel IGFET Model) Group develops physics-based, accurate, scalable, robust, and predictive MOSFET SPICE models for circuit simulation and CMOS technology development.
|3D Systems Packaging Research Center|
The Georgia Tech 3D Systems Packaging Research Center focuses on Smart, wearable, IOT, automotive, bio-electronics, and high-performance systems research. Focus areas are Electrical, Mechanical, and Thermal Design; Low-cost Glass Interposer and Package; Interconnections and Assembly; Functional Components - Passives and their Integration with Actives; 3D Glass Photonics; and MEMS and Sensors – High-power and High-temperature Electronics.
|Georgia Tech||Malcolm Chen|
|MIT Microsystems Technology Laboratories (MTL)|
MTL is predicated on the notion that nanoscale science and technology can help solve some of the world’s greatest problems in areas of energy, communications, water, health, information, and transportation. The focus is on fundamental research and engineering in materials, structures, devices, circuits and systems. MTL’s activities encompass integrated circuits, systems, electronic and photonic devices, MEMS, bio-MEMS, molecular devices, nanotechnology, sensors, and actuators.
|Heterogeneous Integration and Performance Scaling (CHIPS)|
Starting from the application space, the design environment, and the integration scheme, appropriate new materials and components are being developed. These include energy sources, memory, sensors, passives, electromechanical and medical devices. UCLA CHIPS has pioneered the dielet revolution and develops new methodologies and infrastructure for integrating dielets (sometimes also called chiplets) at pitches comparable to on-chip wiring levels, enabling both latencies, bandwidth and energy per bit comparable to monolithic integration, but at the board level. CHIPS center has developed integration platforms for both rigid electronics based on silicon, flexible platforms based on bio-compatible materials, and monolithic 3D integration using wafer-to-wafer bonding for memory scaling and cognitive applications.
|NTU-TSMC Research Center at National Taiwan University|
The major research interest of the Center include: 2D material, 2D devices, band structure analysis and simulation, emerging Si- & SiGe-based transistor, nanosheet transistor, backend interconnect, graphene, self-assembled monolayer molecule, high-K dielectric deposition, stacking of 3D electronics, ferroelectric material & memory, atomic layer technologies, negative capacitance FET, quantum computing using Si qubit, and synchrotron radiation photoemission studies on high-k/semiconductor interfaces.
|NCTU-TSMC Research Center at National Chiao Tung University|
The major research interests include: monolithic stacked devices and circuits, negative-capacitance FETs, two-dimensional material field-effect transistors, 2D contact engineering, low-resistance interconnect technology, low contact resistance technology, and FinFETs technology for high speed and high frequency applications.
|NTHU-TSMC Research Center at National Tsing Hua University|
Research interests focus on computing in memory, computing in sensor, neuromorphic computing, and advanced embedded computing to improve the combination of speed and power consumption by orders of magnitude, EUV negative resist with potential of high light absorption rate, small resist blur and thin resist film, EUV interference imaging platform, e-beam imaging platform and micro detector array for process improvement, etc. The Center also conducts more than 10 JDPs annually.
|NCKU-TSMC Research Center at National Cheng Kung University|
The research focuses are quantum computing and RF circuit research & development. That includes fundamental qubit devices to the integration of multiple qubits, qubit test, noise analysis, cryo-CMOS device and modeling, design and integration of 24-GHz sensor RF receiver system, 24-GHz sub-circuits of LNA, PA, VCO, Mixer, PLL and its sensing application etc. The Center also conducts more than 10 JDPs annually.
Stay connected with the next generation of innovators
|Stanford SystemX Alliance||Stanford||Malcolm Chen|
|Non-volatile Memory Technology Research Initiative (NMTRI)||Stanford||Malcolm Chen|
|Berkeley Emerging Technologies Research (BETR) Center||Berkeley||Malcolm Chen|
|Berkeley Device Modeling Center||Berkeley||Malcolm Chen|
|3D Systems Packaging Research Center||Georgia Tech||Malcolm Chen|
|MIT Microsystems Technology Laboratories (MTL)||MIT||Malcolm Chen|
|Heterogeneous Integration and Performance Scaling (CHIPS)||UCLA||Malcolm Chen|
|NTU-TSMC Research Center at National Taiwan University||NTU||Derek Lin|
|NCTU-TSMC Research Center at National Chiao Tung University||NCTU||Derek Lin|
|NTHU-TSMC Research Center at National Tsing Hua University||NTHU||Derek Lin|
|NCKU-TSMC Research Center at National Cheng Kung University||NCKU||Derek Lin|