Building high performance transistors on carbon nanotube channel
High-performance and scaled transistors on carbon nanotube (CNT) channel are enabled by the quality of device component modules. This paper advances each module by single-CNT control experiments reporting: (1) remarkable n-type contact resistance of 5.1 kΩ/CNT(20.4Ω−μm for 250 CNT/μm) at 20 nm contact length, (2) tunable N-and Pdoping of CNT with dielectric doping, (3) improvement in top-gate dielectric interface to CNT by channel cleaning, (4) demonstration of channel comprised of dense CNT array with reduced bundle density, and (5) analysis of CNT bandgap tradeoffs with variability control strategy. The first component-complete pMOS FET is demonstrated on high-density CNTs with up to 680 μA/μm at -0.7V VDS. authors: G. Pitner, N. Safron, T.-A. Chao, S. Li, S.-K. Su, G. Zeevi, Q. Lin, H.-Y. Chiu, M. Passlack, Z. Zhang, D. M. Sathaiya, A. Wei, C. Gilardi, E. Chen, S.-L. Liew, V. D.-H. Hou, C.-W. Wu, J. Wu, Z. Lin, J. Fagan, M. Zheng, H. Wang, S. Mitra, H.-S. P. Wong, I. Radu
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Low Dimensional Material & Device
Transistor research team at TSMC is also exploring devices built on materials having intrinsically 2D or 1D carrier transport (low-dimensional transport). Transition metal dichalcogenides, graphene nanoribbons, and carbon nanotubes, among others, are being investigated theoretically and experimentally. TSMC research work is both internally conducted and/or in collaboration with our academic partners through joint development projects, or by active technical participation in leading research consortia or research institutes worldwide. Here we invite you to explore some of TSMC’s recent published work in these fields of active exploratory research.
The benefits of using 2D and 1D materials include high mobility at atomic thickness, excellent gate control, and potential applications for low-power and high-performance devices. Thus, transistor scaling may be extended. In a recent publication, we have successfully demonstrated the growth of wafer-scale h-Boron Nitride monolayer, which is able to efficiently protect the channel 2D semiconductors from process damages and the charge impurity scattering from adjacent dielectrics. 1D semiconducting carbon nanotubes, with processes compatible with the backend-of-line (BOEL) fabrication temperature (< 400 oC), are a potential component for achieving monolithic 3D ICs. The proof-of-concept monolithic integration of carbon nanotube transistors on our 28 nm CMOS technology wafers has also been demonstrated.
