Logic

TSMC has been at the forefront of advanced CMOS logic technologies for which dense transistors are one of the two essential building blocks, the other being dense interconnect stacks. The intrinsic computing capability of a given logic technology is directly related to the number of interconnected transistors and their switching speed under representative loads originating from both the transistor or gates being driven and the related interconnect resistive and capacitive circuit loads.

TSMC research and development is continuously exploring novel and scalable transistor concepts to ensure sustainable, cost-effective, leading-edge logic technology performance and energy efficiency. We invite you to explore some of TSMC research areas in transistor structure, high-mobility channel, and low-dimensional materials and devices.

  • A simulation perspective: The potential and limitation of Ge GAA CMOS

    2018
    The electrical characteristics of <110> n/p Ge nanowire transistors (NWTs) with the cross section of 6×6nm2 have been studied. The ION performance and the subthreshold swing are simulated by multi-subband Boltzmann transport equation and ballistic quantum transport solvers, respectively. The performance of <110> nGe NWTs is sensitive to the barrier height of interfacial layer due to highly-anisotropic Λ-valleys. The dimension-dependent k·p parameters based on tight-binding full band are used to address the strong confinement of pGe NWTs. Comparing to Si NWTs, the intrinsic ION is twice as high for both n/p Ge NWTs at 28nm channel length. As the channel length is scaled down, such ION benefit is maintained till the tunneling effect comes in and degrades the subthreshold swing. authors: Sheng-Kai Su, Edward Chen, and Jeff Wu