High-Performance Integrated Fan-Out Wafer Level Packaging (InFO-WLP): Technology and System Integration
Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art inductors (quality factor of 42 and self-resonance frequency of 16 GHz) has been demonstrated for heterogeneous integration of digital and radio frequency (RF) systems. InFO-WLP promises superior form factor, pin count, and thermal performance to existing flip-chip ball grid array (FC-BGA) packages. In addition, InFO-WLP's high Q inductors can enhance electrical performance and lower power consumption in RF circuit applications. authors: Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo, Huan-Neng Chen, En-Hsiang Yeh, Cheng-Chieh Hsieh, Li-Hsien Huang, Ming-Yen Chiu, John Yeh, Tsung-Shu Lin, Tzu-Jin Yeh, Shang-Yun Hou, Jui-Pin Hung, Jing-Cheng Lin, Chewn-Pu Jou, Chuei-Tang Wang, Shin-Puu Jeng, Douglas C.H. Yu
Interconnect
Interconnect
Interconnect is critically important for system performance. They are structures that connect two or more circuit elements (such as transistors) together electrically. In the past, interconnect was often referred to as on-chip interconnect of integrated circuits. Nowadays interconnect generally includes both on-chip interconnect of integrated circuits and off-chip interconnect in heterogeneous system integration. In interconnect design, geometric dimensions (width, thickness, spacing, aspect ratio, pitch), materials, process control and design layout are all critical to proper interconnect function, performance, power efficiency, reliability, and fabrication yield.
