Advanced heterogeneous integration technology trend for cloud and edge
Advanced heterogeneous integration (HI) technology is much needed for applications from edge to cloud to meet the stringent system-level requirements on performance, power, profile, cycle-time and cost (P3C2). In addition to 3DIC with TSV innovative packaging technologies such as silicon interposer (2.5D) and fan-out wafer-level-packaging (2D/3D) become new paradigm for the semiconductor industry to realize the system integration. In this paper, we will discuss the new trend of advanced packaging technology - a strong need for application-specific integration solutions. Many of those are proposed. The solution with higher performance at lower cost will prevail. Furthermore, the solutions that readily integrate multi-chip to enable chip-partition to extend Moore's Law effectively have long-term advantages. authors: Douglas C.H. Yu
Interconnect
Interconnect
Interconnect is critically important for system performance. They are structures that connect two or more circuit elements (such as transistors) together electrically. In the past, interconnect was often referred to as on-chip interconnect of integrated circuits. Nowadays interconnect generally includes both on-chip interconnect of integrated circuits and off-chip interconnect in heterogeneous system integration. In interconnect design, geometric dimensions (width, thickness, spacing, aspect ratio, pitch), materials, process control and design layout are all critical to proper interconnect function, performance, power efficiency, reliability, and fabrication yield.
