TSMC @ IEDM 2024
Semiconductor Industry Outlook and New Technology Frontiers
At the 70th International Electron Devices Meeting (IEDM) this year, TSMC Executive VP and Co-COO, Dr. Y.J. Mii, delivered a visionary keynote highlighting the semiconductor industry’s promising future and exploring new technological frontiers in device architecture, lithography, and system integration. In addition to Dr. Mii’s keynote, TSMC presented 19 papers on topics such as 2nm nanosheet technology, CFET device architecture, alternative channel materials, 3D integrated circuit technology, transition metal dichalcogenides, 2D material device advancements, and semiconducting oxides. As AI continues to transform every aspect of human existence, it enhances people’s daily lives by driving efficiency, enabling smarter decision-making, and fostering unprecedented innovation across industries. These advancements underscore the mission-critical role of semiconductor technology in powering AI solutions. At TSMC, we are committed to pushing the boundaries of semiconductor technology to create a smarter, more sustainable, and more beautiful world.
Semiconductor Industry Outlook and New Technology
Dr. Y.J. Mii, EVP & Co-COO, TSMC
The semiconductor industry is a dynamic landscape of innovation, where new materials, advanced processing techniques, and cutting-edge design converge to shape the future of technology. Powered by the principle of technology scaling, this field continues to push boundaries, enabling transformative applications in AI, HPC, 5G/6G, autonomous driving, IoT, and more. As we progress through time, scaling evolves, unlocking new levels of chip efficiency and performance. The horizon shines bright with the promise of breakthroughs in EUV lithography, new device architectures like CFETs, novel low-dimensional channel materials, and the strategic synergy of DTCO, paving the way for exciting new technology eras. Additionally, advanced packaging techniques enhance system-level performance, blending computational power to surpass current limitations. The growth in specialty technology segments such as RF, non-volatile memory, power management, CMOS image sensors, and Si photonics expands the range of innovative devices. This keynote paper will explore the latest advancements and emerging trends in the semiconductor industry, offering insights into how these cutting-edge frontiers will drive smart technology integration and create a brighter future for society.
