TSMC @ Conferences
Overview
- Event Type:TSMC @ Conferences
- Date:December 7 - 11, 2024
Lipen Yuan
Short Course: Sailing into the Future of the Semiconductor Industry
The semiconductor industry is embarking on a major transformation as Artificial Intelligence (AI) permeates into every aspect of our lives through innovations in products and services. High Performance Computing (HPC) is at the forefront of this revolution, with advancements in processors, interconnects, storage, and re-shaping of data centers for AI workloads. Mobile devices are incorporating AI capabilities and evolving into personal assistants, aided by enhanced wireless connectivity. In the automotive sector, advancements in architecture such as Software-Defined Vehicle and Zonal control, as well as features like In-Vehicle Infotainment and Advanced Driver Assistance Systems (ADAS), are underpinning the development of greener, safer, and smarter vehicles. The Internet of Things (IoT) is transitioning to AIoT with built-in intelligence for more convenience and better user experience. Energy efficiency, memory bandwidth, enriched feature set and smaller form factor are common product requirements to be addressed by a portfolio of technologies in order to enable the system-level innovations that will in turn shape the future of the industry.
Chih-Hang Tung
Tutorial: System Scaling with Wafer Level Integration Technologies
The role of System integration and packaging in semiconductor industry has transformed in recent years. Driven by markets diversification and front-end transistor scaling challenges, wafer Level System Integration enables system scaling complementing Moore’s Law transistor scaling. This tutorial focus on technologies enablement by chip stacking and Wafer level interconnection. Technologies and challenges from electrical, structural, and to thermal are discussed. Industry solutions are covered. Novel and new heterogeneous integration of non-CMOS components, including photonics are also discussed for their potential future roles in system Power, Performance, Area, and Cost (PPAC) scaling.
