2022 VLSI – Plenary Session
Semiconductor Innovations, from Device to SystemAbstract:
This year marks the 75th anniversary since the invention of the transistor and hence the beginning of the semiconductor industry that has had profound impact on the world and society at large. Technology scaling has been the key driving force behind the numerous innovations that usher in the Information Age. As the fast-expanding new applications in 5G, AI, ADAS, AR/VR and robotics continue to propel the demand for data-centric products and services, future generations of semiconductor technology will require innovations across the entire stack – from material and device to design infrastructure, architecture and system. In this paper, we will share our perspective of the applications trends and technology advancements that have brought us thus far. We will also outline key innovations that could lay the foundation for future logic technologies. We will conclude the presentation of our vision with 3D stacking technologies to extend scaling beyond existing frontier into the era of system integration, thus enabling a roadmap of energy-efficient compute to continue into the foreseeable future.
Dr. Y.J. Mii
Dr. Y.J. Mii is Senior Vice President of Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Mii joined TSMC in 1994 as a manager at Fab 3 and then joined the company's R&D organization in 2001. In 2011, Dr. Mii was appointed Vice President of Research and Development and later he was promoted to Senior Vice President in November 2016. In more than two decades of services at TSMC, Dr. Mii has contributed greatly to the development and manufacturing of advanced CMOS technologies in both Fab Operations and R&D. He successfully managed the development of 90nm, 40nm and 28nm technologies. By spearheading the research and development of 16nm, 7nm, 5nm, and beyond, he has helped maintain TSMC's technology leadership in the foundry segment of the global semiconductor industry. Dr. Mii received the National Manager Excellence Award in 2008, recognizing his innovative “half-node” concept for 40nm process technology that improved performance and reduced die size. He also received the National Engineering Excellence Award in 2004. Before joining TSMC, Dr. Mii was a research staff member at IBM Research Center. Dr. Mii has 34 patents globally, including 25 US patents, and holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).