2021 ISSCC - Plenary Session english

Invited Talks

2021 ISSCC - Plenary Session

Monday, February 15
7:00 a.m. PST

Title: Unleashing the Future of Innovation


The foundry business model, pioneered by TSMC more than three decades ago, brought a sea change to technology innovation and how integrated circuits (ICs) and systems are designed and manufactured. Access to semiconductor technology is no longer limited to large corporations that invest billions of dollars to build a fabrication plant. The foundry model has democratized IC innovation, making it available to all visionaries and innovators. Today, an open innovation platform that connects innovators with semiconductor-technology providers is a vital link in the global supply chain. Our industry has already begun to look beyond just engineering individual chips manufactured on wafers, and have moved to integrate individual chips into systems. System performance and energy efficiency will continue to advance at historical rates, driven by innovations from many aspects, including materials, device and integration technology, circuit design, architecture, and systems. User applications drives design choices, and design choices are enabled by technology advancements. Advances in an open innovation ecosystem will further lower the entry barriers and unleash the future of innovation.

Mark Liu

Chairman, TSMC

Speaker Bios:

Dr. Mark Liu is Chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to assuming this post, he was President and Co-CEO of TSMC from 2013 to 2018, where he oversaw TSMC's leading-edge technology development, and was Co-Chief Operating Officer from 2012 to 2013. Before that, he served in a number of executive positions at TSMC, including Senior Vice President of the Advanced Technology Business and Senior Vice President of Operations. Dr. Liu established TSMC's first 12-inch fab, and later TSMC's GIGAFAB® operations. He also served as President of Worldwide Semiconductor Manufacturing Corp prior to its merger with TSMC. Dr. Liu joined TSMC in 1993 as an engineering deputy director and established TSMC's first 8-inch fab. Before joining TSMC, Dr. Liu was with AT&T Bell Laboratory in Holmdel, NJ, from 1987 to 1993 as a research manager for the High Speed Electronics Research Laboratory, working on optical fiber communication systems. From 1983 to 1987, he was a process integration manager at Intel Corporation, Santa Clara, CA, developing technologies for Intel microprocessors. Dr. Liu is also Chairman of the Taiwan Semiconductor Industry Association (TSIA). In addition, he serves on the Presidential CEO Advisory Board of the Massachusetts Institute of Technology, and on the Engineering Advisory Board of the UC Berkeley College of Engineering. Dr. Mark Liu received B.S. degree in electrical engineering from National Taiwan University. He received M.S. and Ph.D. degrees in electrical engineering and computer science from University of California, Berkeley.