2020 IEEE 70th Electronic Components and Technology Conference english

Invited Talks

2020 IEEE 70th Electronic Components and Technology Conference

Title: Innovative Heterogeneous Integration Technologies Initiate a New Semiconductor Era

Abstract:

Packaging technology used to play mainly a protection role in the supply chain for IC, which follows the path of Moore’s Law with system-on-chip. When chip scaling becomes more challenging and, at the same time, we want to integrate more functions such as memory, sensors and passives, etc. for new applications such as AI and 5G, etc, innovative heterogeneous integration technologies are proposed for system-on-package to provide critical PPA values of the micro-systems. We are making far-reaching changes, which initiate an exciting new semiconductor era and create a new industry landscape.

Douglas Yu

TSMC Distinguished Fellow and Vice President, Research & Development / Pathfinding for System Integration

Speaker Bios:

Dr. Douglas Yu is Vice President of Pathfinding for System Integration under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to his appointment to Vice President in 2016, Dr. Yu was Senior Director of the Integrated Interconnect & Packaging Division. Dr. Yu joined TSMC in 1994, serving in a variety of roles throughout his career including backend R&D, and developed technologies critical to the Company’s highly successful transition to copper process at the 0.13 micron generation. Dr. Yu also pioneered TSMC’s wafer-level system integration technologies, including Chip on Wafer on Substrate (CoWoS®), Integrated Fan-Out (InFO), and TSMC System on Integrated Chips (SoIC™), as well as their derivatives. Prior to joining TSMC, Dr. Yu was a Member of Technical Staff and Project Leader at AT&T Bell Labs in USA, working on sub-micron process, device and integration technologies R&D from 1987 to 1994. Dr. Yu became a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013, and received the Presidential Science Prize of Taiwan in 2017 as well as the IEEE EPS Outstanding Manufacturing Technology Award in 2018. He has received more than 1,800 worldwide patents while serving at TSMC. Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and Ph.D. in Materials Engineering from Georgia Institute of Technology.