2021 ISSCC - Forum 5: Enabling New System Architectures with 2.5D, 3D, and Chiplets chinese

Invited Talks

2021 ISSCC - Forum 5: Enabling New System Architectures with 2.5D, 3D, and Chiplets

Monday, February 12

Title: Foundry Solutions for 2.5D/3D Integration

Abstract:

Semiconductor technology migration is challenged by SoC Scaling, along with power, thermal and memory walls. Chiplets integration is a feasible resolution to address those issues. However, chiplet technology need innovation and leverage to achieve the goal. In this paper, we present foundry 3DFabric™ 2.5/3/3+ solutions to integrate chiplets for near- and long-term need. Close collaboration among the supply chain are strongly encouraged. We also propose a 3DIC (3D Interconnect Density) migration roadmap for industry and academia to align overall research and development activities.

Douglas Yu

TSMC Distinguished Fellow and Vice President, Research & Development / Pathfinding for System Integration

Speaker Bios:

Dr. Douglas Yu is Vice President of Pathfinding for System Integration under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to his appointment to Vice President in 2016, Dr. Yu was Senior Director of the Integrated Interconnect & Packaging Division. Dr. Yu joined TSMC in 1994, serving in a variety of roles throughout his career including backend R&D, and developed technologies critical to the Company’s highly successful transition to copper process at the 0.13 micron generation. Dr. Yu also pioneered TSMC’s wafer-level system integration technologies, including Chip on Wafer on Substrate (CoWoS®), Integrated Fan-Out (InFO), and TSMC System on Integrated Chips (SoIC™), as well as their derivatives. Prior to joining TSMC, Dr. Yu was a Member of Technical Staff and Project Leader at AT&T Bell Labs in USA, working on sub-micron process, device and integration technologies R&D from 1987 to 1994. Dr. Yu became a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013, and received the Presidential Science Prize of Taiwan in 2017 as well as the IEEE EPS Outstanding Manufacturing Technology Award in 2018. He has received more than 1,800 worldwide patents while serving at TSMC. Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and Ph.D. in Materials Engineering from Georgia Institute of Technology.